MagnaChip launches roadshows for high yield bond

Korean semiconductor company hopes to raise $750 million from multi-tranche bond

MagnaChip Semiconductor, the non-memory arm recently sold by Hynix Semiconductor, has launched roadshows for a debut bond issue via lead managers Citigroup, JPMorgan and UBS. The deal has been structured to optimize the balance sheet of the company following its sale to a consortium of international private equity investors in October.

The deal comprises a $500 million senior secured issue, which has a 2011 maturity and both fixed and floating rate tranches, plus a $200 million senior subordinated tranche due 2014.

Ratings are about to be assigned and the company is expected to get a non-investment grade double-B rating below fellow foundry operators UMC...

FinanceAsia has updated its subscription model.

Registered readers now have the opportunity to read 5 articles from our award-winning website for free.

To obtain unlimited access to our award-winning exclusive news and analysis, we offer subscription packages, including single user, team subscription (2-5 users), or office-wide licences.

To help you and your colleagues access our proprietary content, please contact us at [email protected], or +(852) 2122 5222

Article limit is reached.

Hello! You have used up all of your free articles on FinanceAsia.

To obtain unlimited access to our award-winning exclusive news and analysis, we offer subscription packages, including single user, team subscription (2-5 users), or office-wide licences. To help you and your colleagues access our proprietary content, please contact us at [email protected], or +(852) 2122 5222