HK's central bank subsidy aims to boost digital bond offering

The Hong Kong Monetary Authority HKMA will offer eligible digital bond issuances up to HK$2.5 million $320,000 in a subsidy, as the city eyes becoming a regional leader in digital bond issuances.

Published on November 28, the Digital Bond Grant Scheme DBGS started accepting applications on the same day. To qualify for application, a digital bond offering must be issued in Hong Kong on or after October 16, 2024 on a distributed-ledger technology DLT platform offered by a party that has substantial presence in Hong Kong, or by the Central Moneymarkets Unit CMU, the fixed income clearing system by HKMA.

Those meeting the requirements...